surface mount relay g6h2f low profile, miniature, surface mount relay ultra low profile only 5.2mm. can be soldered by vps or irs methods. impulse withstand voltage meets fcc and ccitt rules. low power consumption, 140mw. available on tape for automatic insertion. ordering information classification single-side stable dpdt fully sealed G6H-2F note: 1. when ordering, add the rated coil voltage to the model number . example: G6H-2F 12 vdc 2. when ordering tape packing, add `tr' to the model number . example: G6H-2F tr 12 vdc 3. `tr'is not part of the relay model number , it is not marked on the relay case. rated coil voltage t ape packing model number legend: 1. taped v ersion tr: t aped right tl: t aped left 2. rated coil v oltage 5, 12, 24 vdc g6h2f - 1 2 specifications coil ratings single-side stable types rated voltage 5 vdc 12 vdc 24 vdc rated current 28.1 ma 1 1.7 ma 8.3 ma coil resistance 178 w 1,028 w 2,880 w coil inductance armature off 0.065 0.43 1.2 (h) (ref. value) armature on 0.058 0.37 1.0 must operate voltage 75% max. of rated voltage must release voltage 10% min. of rated voltage max. voltage 200% of rated voltage at 23 c, 150% at 70 c 170% of rated voltage at 23 c, 130% at 70 c power consumption approx. 140 mw approx. 200 mw note: 1. the rated current and coil resistance are measured at a coil temperature of 23 c with a tolerance of 10%. 2. operating characteristics are measured at a coil temperature of 23 c. contact ratings load resistive load (cos ? = 1) rated load 0.5 a at 125 v ac; 1 a at 30 vdc contact material ag (au-clad) rated carry current 1 a max. switching voltage 125 v ac, 1 10 vdc max. switching current 1 a max. switching capacity 62.5 v a, 33 w min. permissible load 10 m a at 10 mvdc
note: p level: l 60 = 0.1 x 10 -6 /operation characteristics contact resistance 60 m w max. operate (set) time 3 ms max. (mean value: approx. 2 ms) release (reset) time 2 ms max. (mean value: approx. 1 ms) bounce time operate: 0.5 ms max. release: 0.5 ms max. max. operating frequency mechanical: 36,000 operations/hr electrical: 1,800 operations/hr (under rated load) insulation resistance 1,000 m w min. (at 500 vdc) dielectric withstand voltage 1,000 v ac, 50/60 hz for 1 min between coil and contacts 1,000 v ac, 50/60 hz for 1 min between contacts of dif ferent polarity 750 v ac, 50/60 hz for 1 min between contacts of same polarity impulse withstand voltage 1,500 v 10 x 160 m s between contacts of same polarity (conforms to fcc part 68) v ibration resistance destruction: 10 to 55 hz, 5-mm double amplitude malfunction: 10 to 55 hz, 3-mm double amplitude shock resistance destruction: 1,000 m/s 2 (approx. 100g) malfunction: 500 m/s 2 (approx. 50g) life expectancy mechanical: 100,000,000 operations min. (at 36,000 operations/hr) electrical: 200,000 operations min. (0.1 a at 1 10 v ac inductive load) ambient temperature operating: 40 c to 85 c (with no icing) ambient humidity operating: 35% to 85% weight approx. 1.5 g note: the data shown above are initial values. approved by standards ul114, ul478 (file no. e41515)/csa c22.2 no. 0, no. 14 (file no. lr24825) model contac tform contac tform contact form g6h2f dpdt 3 to 48 vdc 1a, 30 vdc 0.3a, 100 vdc 0.5a, 125 vdc engineering data max. switching capacity life expectancy switching current (a) switching voltage (v) switching current (a) life expectancy (x10 operations) 3 ac resistive load dc resistive load 30-vdc resistive load 125-vac resistive load 10,000 7,000 5,000 3,000 1,000 700 500 300 100 dimensions 0.3 2.54 1 2.94 2 9.56 14 9 0.25 7.62 11.5 5.2 6.5 14 0.2 2.54 0.5 note : orientation marks are as follows: glue pads
precautions surface temperature of pc board vs. recommended soldering time 1. vps 2. irs time (s) t ime (s) 215 c max. preheating soldering air cooling t emperature ( c) t emperature ( c) 220 to 240 180 to 200 150 20 to 30 215 180 to 200 90 to 100 90 to 120 40 to 60 preheating soldering air cooling 90 to 120 3. other considerations ? soldering iron heat t emperature at tip: 280 c to 300 c power: 30 w to 60 w heating time: 3 s to 5 s ? when soldering with a pulse heater, hot air, or laser, take into account such factors as heat stress, and test the process under actual conditions. mounting ? can be mounted in any orientation. ? not suitable for socket mounting. ? do not reverse the coil polarity . ? the diagram below the minimum spacing necessary when mounting more than one relay on a printed circuit board. 2,54 mm min. surface mounting t erminals terminals l terminals (g6h2f) characteristics ? soldering methods irs (infrared radiation furnace) vps (v apor phase) ? removal and replacement is simple. glue pads glue pads glue pads are projections from the relay case where adhesive is applied to temporarily attach the relay to the printed circuit board before soldering. the soldering points are where solder is applied during soldering. ? glue pads are for use with epoxy or uv adhesives. glue pads are located on the sides to allow uv illumination and adhesive curing. t wo points are provided for stability . orientation marks these marks are provided to properly position the relays when they are supplied to the printed circuit board automatically . t wo types of orientation marks are provided. ? mechanical: a u-shaped impression along the top edge is used for alignment. ? optical: a dark mark on the top surface is used for alignment. cleaning methods brushing fine as long as the detergent has no chemical dipping or electrical af fect on the relay . spraying vapor hot water ultrasonic fine as long as the detergent has no chemical or electrical af fect on the relay . the model number of the ultrasound cleaning-type relay ends in a-uo.
tape packing ? taping method t ape type: te2416r (or l) reel type: r53 there are 500 relays per reel. relay orientation: g6h2ftl G6H-2F-tr direction direction 29.5 cover tape 1.55 dia. 2 4 1.75 24 11.5 (10.75) 16 1.5 dia. min. 12.1 0.3 4 r0.3 max. 0.3 ? 330 carrier tape emboss tape dimensions 0.38 0.05 14.5 0.1 6.9 0.1
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